Vertiv launches modular AI cooling for dense data centres

Vertiv has introduced new configurations of its MegaMod HDX modular power and liquid cooling system for high-density computing environments across North America and EMEA.

The company said the prefabricated system targets artificial intelligence and high-performance computing deployments. Vertiv said the models are available globally.

Vertiv positioned MegaMod HDX as a hybrid approach that combines direct-to-chip liquid cooling with air cooling. The company linked the design to heat management for GPU-based systems and pod-style deployments.

System options

Vertiv said the new configurations come in compact and combo versions. The compact version uses a standard module height. Vertiv said it supports up to 13 racks and up to 1.25 MW of power capacity.

The combo version uses an extended-height design. Vertiv said it supports up to 144 racks and up to 10 MW of power capacity.

Vertiv said both versions support rack densities from 50 kW to more than 100 kW per rack. The company framed this range around the shift towards higher rack densities associated with modern AI systems.

Cooling design

Vertiv said MegaMod HDX integrates direct-to-chip liquid cooling with air-cooled architectures. The company said this combination addresses thermal requirements associated with AI workloads.

Vertiv also described the product as a prefabricated modular design. The company said prefabrication can reduce site work and standardise build processes.

"Today's AI workloads demand cooling solutions that go beyond traditional approaches. With the Vertiv MegaMod HDX available in both compact and combo solution configurations, organisations can match their facility requirements while supporting high-density, liquid-cooled environments at scale. Our designs deliver what data centres need most - reliable performance, operational efficiency, and the ability to scale their AI infrastructure with confidence," said Viktor Petik, Senior Vice President, Infrastructure Solutions, Vertiv.

Power resilience

Vertiv said the MegaMod HDX designs use distributed redundant power architecture. The company said this approach supports continued operation if one module goes offline.

Vertiv also said the system includes a buffer-tank thermal backup feature. The company said this allows GPU clusters to maintain stable operations during maintenance or load transitions.

Vertiv said the factory-integrated approach includes integrated and fully tested components. The company also referenced its global service network as part of its support model.

Broader portfolio

Vertiv said the MegaMod HDX configurations draw on other Vertiv products. These include the Liebert APM2 uninterruptible power supply, CoolChip CDU cooling distribution unit, PowerBar busway system, and Unify infrastructure monitoring.

The company also listed rack-related products that it said can sit alongside the modular infrastructure. These include Vertiv racks and OCP-compliant racks, the CoolLoop RDHx rear door heat exchanger, CoolChip in-rack CDU, rack power distribution units, PowerDirect in-rack DC power system, and CoolChip Fluid Network Rack Manifolds.

Vertiv operates in more than 130 countries and supplies power and cooling equipment for data centres and related infrastructure. The company said the MegaMod HDX configurations are intended for operators facing higher power and cooling requirements linked to AI deployments.